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RJ(ARJ2)
SMD RELAYS WITH 8GHz CAPABILITIES
RJ-RELAYS
TYPICAL APPLICATIONS
Measurement equipment market Attenuator circuits, spectrum analyzer, oscilloscope, mobile equipment, tester Mobile telecommunication market IMT2000, microwave communication Medical instruments market
FEATURES
14.0 .551 9.00 .354 8.20 .323
14.0 .551
9.00 .354 8.20 .323
* Excellent high frequency characteristics (50, at 5GHz) V.S.W.R.: Max. 1.25 Insertion loss: Max. 0.5dB Isolation: Min. 35dB (Between open contacts) Min. 30dB (Between contact sets) * Surface mount terminal Surface mount terminals are now standard so there is much less work in designing PC boards. * Small size Size: 14.00 (L)x9.00 (W)x8.20 (H) mm .551 (L)x.354 (W)x.323 (H) inch
SPECIFICATIONS
Contact
Arrangement Contact material Initial contact resistance Contact rating Rating Contact carrying power Max. switching voltage Max. switching current V.S.W.R. Insertion loss (without D.U.T. board's loss) Between open contacts Isolation Between contact sets Input power Expected life (min. operations) Mechanical (at 180 cpm) 1W, at 5GHz, Electrical V.S.W.R. & 1.25 (at 10mA 10V DC 20cpm) (resistive load) 2 Form C Gold alloy Max. 150m 1W (at 5 GHz, Impedance 50 , V.S.W.R. &1.25) 10mA 10V DC (resistive load) 1W (at 5 GHz, Impedance 50 , V.S.W.R. &1.25) 30 V DC 0.3 A DC Max. 1.25 Max. 0.5dB Min. 35dB Min. 30dB
Characteristics
Initial insulation resistance*1 Min. 500 M (at 500 V DC) Between open contacts 500 Vrms Initial breakdown Between contact sets 500 Vrms voltage*2 Between contact and coil 500 Vrms Operate time [Set time]*3 (at 20C) Max. 5ms Release time (without diode)[Reset time]*3 Max. 5ms (at 20C) 4 Temperature rise (at 20C)* Max. 50C Functional*5 Min. 500 m/s2 Shock resistance Destructive*6 Min. 1,000 m/s2 10 to 55 Hz at double Functional*7 amplitude of 3 mm Vibration resistance 10 to 55 Hz at double Destructive amplitude of 5 mm Conditions for operation, -30C to 70C Ambient temp. transport and storage*8 -22F to 158F (Not freezing and condensHumidity 5 to 85% R.H. ing at low temperature) Unit weight Approx. 3 g .11 oz
High frequency characteristics (Initial) (~5GHz, Impedance 50)
1W (at 5GHz, impedance 50, V.S.W.R. &1.25, at 20C) 107
105 106
Remarks
* Specifications will vary with foreign standards certification ratings. *1 Measurement at same location as "Initial breakdown voltage" section. *2 Detection current: 10mA *3 Nominal operating voltage applied to the coil, excluding contact bounce time. *4 By resistive method, nominal voltage applied to the coil, 5GHz, V.S.W.R. & 1.25 *5 Half-wave pulse of sine wave: 6ms, detection time: 10s. *6 Pulse of sine wave: 11ms. *7 Detection time: 10s *8 Refer to 6. Conditions for operation, transport and storage mentioned in NOTES
Coil (at 20C, 68F)
Single side stable 2 coil latching Nominal operating power 200 mW 150 mW
ORDERING INFORMATION
Ex. ARJ Contact arrangement Operating function 2: 2 Form C 2 Terminal shape Coil voltage (DC) 03 : 3V 4H: 4.5V 12 : 12V 24 : 24V Packing style
Nil: Carton packing X: Tape end reel packing (picked from 1/2/3-pin side) Z: Tape and reel packing (picked from 6/7/8-pin side) Note: Tape and reel packing symbol "-Z" is not marked on the relay. "X" type tape and reel packing (picked from 1/2/3-pin side) is also available. Suffix "X" instead of "Z".
0: Single side stable Nil: Standard PC board terminal 2: 2 coil latching A: Surface-mount terminal
2
RJ(ARJ2)
TYPES AND COIL DATA (at 20C 68F)
1. Standard PC board terminal * Packing of standard PC board terminal: 50 pcs. in an inner package (carton); 500 pcs. in an outer package
Operating function Coil Rating, V DC 3 4.5 12 24 Part No. Pick-up voltage, Drop-out voltage, Nominal operating Coil resistance, V DC (max.) V DC (min.) current, mA Standard PC (10%) (initial) (initial) (10%) board terminal ARJ2003 2.25 0.3 66.6 45 ARJ204H 3.375 0.45 44.4 101.2 ARJ2012 9 1.2 16.6 720 ARJ2024 18 2.4 8.3 2,880 Part No. Standard PC board terminal ARJ2203 ARJ224H ARJ2212 ARJ2224 Nominal operating power, mW 200 200 200 200 Max. allowable voltage, V DC 3.3 4.95 13.2 26.4
Single side stable
Operating function
Coil Rating, V DC 3 4.5 12 24
Set voltage, V DC (max.) (initial) 2.25 3.375 9 18
Reset voltage, V DC (min.) (initial) 2.25 3.375 9 18
Nominal operating Coil resistance, current, mA (10%) (10%) 50 33.3 12.5 6.3 60 135 960 3,840
Nominal operating power, mW 150 150 150 150
Max. allowable voltage, V DC 3.3 4.95 13.2 26.4
2 coil latching
2. Surface-mount terminal * Packing of surface-mount terminal: 50 pcs. in an inner package (carton); 500 pcs. in an outer package * Packing of surface-mount terminal: 500 pcs. in an inner package (tape and reel); 500 pcs. in an outer package
Operating function Coil Rating, V DC 3 4.5 12 24 Part No. Pick-up Drop-out Nominal operating Coil Nominal Max. allowable current, mA resistance, operating Carton Tape and reel voltage, V DC voltage, V DC voltage, V DC (max.) (initial) (min.) (initial) (10%) (10%) power, mW packing packing ARJ20A03 ARJ20A03Z 2.25 0.3 66.6 45 200 3.3 ARJ20A4H ARJ20A4HZ 3.375 0.45 44.4 101.2 200 4.95 ARJ20A12 ARJ20A12Z 9 1.2 16.6 720 200 13.2 ARJ20A24 ARJ20A24Z 18 2.4 8.3 2,880 200 26.4 Part No. Set voltage, Reset voltage, Nominal operating Coil Nominal Max. allowable current, mA resistance, operating Carton Tape and reel V DC (max.) V DC (min.) voltage, V DC (initial) (initial) (10%) (10%) power, mW packing packing ARJ22A03 ARJ22A03Z 2.25 2.25 50 60 150 3.3 ARJ22A4H ARJ22A4HZ 3.375 3.375 33.3 135 150 4.95 ARJ22A12 ARJ22A12Z 9 9 12.5 960 150 13.2 ARJ22A24 ARJ22A24Z 18 18 6.3 3,840 150 26.4
Single side stable
Operating function
Coil Rating, V DC 3 4.5 12 24
2 coil latching
REFERENCE DATA
1. High frequency characteristics Sample: ARJ20A12 Measuring method: Measured with MEW PC board by HP network analyzer (HP8510C).
* V.S.W.R. characteristics
2.0 1.9 Insertion loss, dB 1.8 V.S.W.R. 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 45MHz 5GHz Frequency 8GHz 3.0 45MHz 5GHz Frequency 8GHz 0.5 Isolation, dB 1.0 1.5 2.0 60 2.5 Between open contact 70 80 45MHz 5GHz Frequency 8GHz
* Insertion loss characteristics (without D.U.T. board's loss)
0
* Isolation characteristics
0 10 20 Between contact sets 30 40 50
3
RJ(ARJ2)
DIMENSIONS
1. Standard PC board terminal Schematic (Bottom view)
Expansion of A Single side stable
Direction indication 10.6 .417 10.4 .409 0 to 0.2 0 to .008 (Typical: 0.1) (Typical: .004) 12.2 .480 14.0 .551 3.50 .138 A 8.20 .323 0.40 .016 7.62 .300 0.50 .020 3.81 .150 24 ribs should be soldered with PC board ground. 9.00 .354 3Better HF characteristics may be obtained when this portion is soldered with PC board ground. +1 10 NC 9 8 76 Com Com 2 3- 4 NO 5 10 NC 9 +8 7 6- Com
mm inch
2 coil latching
+1 Com 2 3- 4 NO 5
(Deenergized condition)
(Reset condition)
0.50 .020
8.89 .350 12.70 .500 11.40 .449
0.20 .008 0.50 .020
6.36 .250 0.20 .008 0.15 .006
1All bottom surface of the base should be touched closely or soldered with PC board ground.
General tolerance: 0.3 .012
2. Surface mount terminal Schematic (Top view)
Expansion of A Single side stable
Direction indication 0.50 .020 10.6 .417 0 to 0.2 0 to .008 10.4 .409 0.50 .020 0.40 .016 3.81 .150 (Typical: 0.1) (Typical: .004) 9 NC 10 +1 2 3- Com 8 Com 76 5 NO 4 9 NC 10 +1 2 3- Com
2 coil latching
Com 7 6- 5 NO 4
+8
8.89 .350 12.2 .480 14.0 .551
24 ribs should be soldered with PC board ground.
(Deenergized condition)
(Reset condition)
9.00 .354 A 0.20 .008 3Better HF characteristics 8.20 may be obtained when this .323 portion is soldered with PC board ground. 10.0 .394
15.0 .591 11.40 .449 6.36 .250
0.50 .020 1All bottom surface of the base should be touched closely or soldered with PC board ground.
General tolerance: 0.3 .012
4
RJ(ARJ2)
NOTES
1. Coil operating power Pure DC current should be applied to the coil. The wave form should be rectangular. If it includes ripple, the ripple factor should be less than 5%. However, check it with the actual circuit since the characteristics may be slightly different. The nominal operating voltage should be applied to the coil for more than 20 ms to set/reset the latching type relay. 2. Coil connection When connecting coils, refer to the wiring diagram to prevent mis-operation or malfunction. 3. External magnetic field Since RJ relays are highly sensitive polarized relays, their characteristics will be affected by a strong external magnetic field. Avoid using the relay under that condition. 4. Cleaning For automatic cleaning, the boiling method is recommended. Avoid ultrasonic cleaning which subjects the relays to high frequency vibrations, which may cause the contacts to stick. It is recommended that alcoholic solvents be used. 5. Tape and reel packing 1) Tape dimensions
16.00 .630 4.00 .157 2.0 (Accumulation 10 pitch: .079 400.1 1.575.004) 1.75 .069 11.50 .453 8.80 .346 0.400.05 8.50 .016.002 .337
3 to 5
6. Conditions for operation, transport and storage conditions 1) Ambient temperature, humidity, and atmospheric pressure during usage, transport, and storage of the relay: (1) Temperature: -30 to +70C -22 to +158F (However, tolerance range is -30 to +60C -22 to +140F if package is carried as is.) (2) Humidity: 5 to 85% RH (Avoid freezing and condensation.) The humidity range varies with the temperature. Use within the range indicated in the graph below. (3) Atmospheric pressure: 86 to 106 kPa Temperature and humidity range for usage, transport, and storage:
Humidity, %R.H.
7. Soldering 1) Surface-mount terminal In case of automatic soldering, the following conditions should be observed (1) Position of measuring temperature
1.0mm .039inch B A
A: Surface of PC board where relay is mounted. B: Above the PC board surface.
(2) IR (infrared reflow) soldering method
A: B:
T5 T4 T3 T2 T1
t1
85 Tolerance range (Avoid freezing when used at temperatures lower than 0C 32F) 5 -30 -22 (Avoid condensation when used at temperatures higher than 0C 32F) 0 70 32 158 Temperature, C F T1=150C 302F T2=160C 320F T3=183C 361F T4=245C 473F T5=270C 518F
t2 t3 t4 t5
t2 - t1 = 80 to 120 s t5 - t3 = 30 to 40 s t4 = 170 to 190 s
7.40 .291 1.50 .059
11.20 .441 6.20 .244 11.40 .449 9.40 5 .370 3 to
16.00 24.00 .630 .945 14.40 .570
(10.75) (.423)
1.33 .052 2.57 .101
2) Dimensions of plastic reel
210.8 dia. .827.031 dia.
2.00.5 .079.020 1001 dia. 3.937.039 dia. 3702 dia. 14.567.079 dia. 130.2 dia. .512.008 dia. 24.4 +2 0 .961 +.079 0
2.00.2 .079.008
2) Condensation Condensation forms when there is a sudden change in temperature under high temperature and high humidity conditions. Condensation will cause deterioration of the relay insulation. 3) Freezing Condensation or other moisture may freeze on the relay when the temperature is lower than 0C 32F. This causes problems such as sticking of movable parts or operational time lags. 4) Low temperature, low humidity environments The plastic becomes brittle if the relay is exposed to a low temperature, low humidity environment for long periods of time. 5) Storage procedures for surface-mount terminal types Since the relay is very sensitive to humidity, it is packed in humidity-free, hermetically sealed packaging. When storing the relay, be careful of the following points: (1) Be sure to use the relay immediately after removing it from its sealed package. (2) When storing the relay for long periods of time after removing it from its sealed package, we recommend using a humidity-free bag with silica gel to prevent subjecting the relay to humidity. Furthermore, if the relay is solder mounted when it has been subjected to excessive humidity, cracks and leaks can occur. Be sure to mount the relay under the required mounting conditions.
Temperature rise of relay itself may vary according to the mounting level or the heating method of reflow equipment. Therefore, please set the temperature of soldering portion of relay terminal and the top surface of the relay case not to exceed the above mentioned soldering condition. It is recommended to check the temperature rise of each portion under actual mounting condition before use. 2) Standard PC board terminal Please meet the following conditions if this relay is to be automatically soldered. (1) Preheating: Max. 100C 212F (terminal solder surface) for max. 60 seconds (2) Soldering: Max. 250C 482F for max. 5 seconds The effect on the relay depends on the actual substrate used. Please verify the substrate to be used. 3) Hand soldering Please meet the following conditions if this relay is to be soldered by hand. (1) Wattage: 30 to 60 W (2) Tip temperature/time: 280 to 300C 536 to 572F for max. 5 seconds The effect on the relay depends on the actual substrate used. Please verify the substrate to be used. 4) Avoid high frequency cleaning since this may adversely affect relay characteristics. Use alcohol-based cleaning solutions when cleaning relays.
ia. a. .1 d i +0 0 0+.0004 d 1.5 59 .0
5
RJ(ARJ2)
Measuring method (Impedance 50)
1 2

78 78 -0.4 -.0 0 16 dia dia . .
. dia a. 60 di 1. 3 4- -.06 4
PORT2 Network B analyzer A R HP 8510C RF OUT B S parameter A test set R
1 2
8.35 .329
a. di . 0 ia .6 d -0 024 4 -. 4 1.00 .039
HP RF IN
8515A
7.62 .300
45
PORT1
* High-frequency load-operating When high-frequency opening and closing of the relay is performed with a load that causes arcs at the contacts, nitrogen and oxygen in the air is fused by the arc energy and HNO3 is formed. This can corrode metal materials.
Three countermeasures for these are listed here. (1) Incorporate an arc-extinguishing circuit. (2) Lower the operating frequency (3) Lower the ambient humidity
3.81 .150
Connector
No. 1 2 Product name HP 85131-60013 HP 83059 Contents 3.5 mm testport, Extension cable 3.5 mm coaxial adaptor
a. di . 0 ia .7 8 d -0 .02 66
. dia . .70 dia 6-1 .067 6-
12.70 .500 17.00 .669 6-1.86 6-.073 0.90 .035
0.40 .016 0.40 .016
(Step 1) Calibrate the test system with HP calibration kit [HP85052B] (Step 2) After calibration, connect the D.U.T. board and measure. Connect 50 terminals on connectors other than those for measurement.
Notes) 1. All bottom surface of the base should be touched closely or soldered with PC board ground. 2. 4 ribs should be soldered with PC board ground.
20.00 6.62 .787 .261
6.72 .265
0.50 .020 8.89 .350 11.70 .461 30.00 1.181
0.50 .020

14.5 .571 10.0 .394 0.40 or 0.50 .016 or .020 1.76 or 1.86 .069 or .073
Measuring board 1) Dimensions
6-1.76 6-.069 0.80 .031 17.00 .669 0.40 .016 0.40 .016
7.07 .278 2.81 .111 0.40 .016 8.89 .350 12.04 .474 8.35 .329 1.00 .039 20.00 .787 0.40 .016
7.22 .284
ole hh . oug dia Thr -0.40 dia. 86 -.016 86
30.00 1.181
2) Material: Glass PTFE double-sided through hole PC board R-4737 (Matsushita Electric Works) 3) Board thickness: t = 0.8 mm 4) Copper plating: 18m * Connector (SMA type receptacle) Product name: R125 510 (RADIALL) Insertion loss compensation The insertion loss of relay itself is given by subtracting the insertion loss of shortcircuit the Com and the NC (or NO). (signal path and two connectors) 9. Others 1) The switching lifetime is defined under the standard test condition specified in the JIS* C 5442-1996 standard (temperature 15 to 35C 59 to 95F, humidity 25 to 75%). Check this with the real device as it is affected by coil driving circuit, load type, activation frequency, activation phase, ambient conditions and other factors. Also, be especially careful of loads such as those listed below. * When used for AC load-operating and the operating phase is synchronous. Rocking and fusing can easily occur due to contact shifting.
2) Use the relay within specifications such as coil rating, contact rating and on/off service life. If used beyond limits, the relay may overheat, generate smoke or catch fire. 3) Be careful not to drop the relay. If accidentally dropped, carefully check its appearance and characteristics before use. 4) Be careful to wire the relay correctly. Otherwise, malfunction, overheat, fire or other trouble may occur. 5) If a relay stays on in a circuit for many months or years at a time without being activated, circuit design should be reviewed so that the relay can remain nonexcited. A coil that receives current all the time heats, which degrades insulation earlier than expected. A latching type relay is recommended for such circuits. 6) The latching type relay is shipped in the reset position. But jolts during transport or impacts during installation can change the reset position. It is, therefore, advisable to build a circuit in which the relay can be initialized (set and reset) just after turning on the power. 7) If silicone materials (e.g., silicone rubbers, silicone oils, silicone coating agents, silicone sealers) are used in the vicinity of the relay, the gas emitted from the silicone may adhere to the contacts of the relay during opening and closing and lead to improper contact. If this is the case, use a material other than silicone. 8) We recommend latching type when using in applications which involve lengthy duty cycles.
* Japanese Industrial Standards
45
12/2/2002 16
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